APL1581 DATASHEET PDF

August 20, 2020 0 Comments

The APL series of high performance positive volt- age regulators are designed for use in applications requiring very low dropout voltage at 5Amp. APL Datasheet PDF Download – DUAL INPUT LOW DROPOUT REGULATOR, APL data sheet. ANPEC APL datasheet, DUAL INPUT LOW DROPOUT REGULATOR (1- page), APL datasheet, APL pdf, APL datasheet pdf, APL

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(PDF) APL1581 Datasheet download

The output capacitors are also used to reduce the slew. For this purpose, the low-ESR capacitors are.

Because parasitic inductors from voltage. For VIN pin, an aluminum. The APL series have internal power and thermal.

The circuit design of using the APL series requires. The following chart shows a stable re. However, the output ca.

APL (ANPEC) PDF技术资料下载 APL 供应信息 IC Datasheet 数据表 (1/20 页)

The thermal pad is soldered to the top VOUT plane which. A low-ESR solid tantalum and aluminum daasheet ca. Dataaheet and Output Sensing Cont. V OUT The output capacitors are also used to reduce the slew rate of load current and help the APL to minimize variations of the output voltage, improving transient response.

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For this purpose, the low-ESR capacitors are recommended. It is not necessary to use low-ESR capacitors. More capacitance reduces the variations of the input voltage at VIN pin.

APL Datasheet PDF –

Remote Voltage Sensing Stability and Output Capacitors The circuit design of using the APL series requires an output capacitor as part of the device frequency compensation. The following chart shows a stable re- gion to select output capacitor for APL This region above the curve indicates minimum required ESR and capacitance to maintain stability.

However, maximum junction temperature ratings should not be exceeded under continuous normal load conditions. Careful con- sideration must be given to all sources of thermal resis- tance from junction to ambient, including junction-to-case, case-to-heat sink interface, and heat sink resistance itself.

See Figure 3, the SOP-8P is a cost-effective package featuring a small size as a standard SOP-8 and a bottom thermal pad to minimize the thermal resistance of the package, being applicable to high current applications.

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The thermal pad is soldered to the top VOUT plane which may be connected to internal or bottom VOUT plane by vias to reduce the heat sink thermal resistance. Therefore, the printed circuit board PCB forms a heat ratasheet and dissipates heat into ambient air. Ultra- low-ESR capacitors, such as ceramic chip capacitors, may promote unstable or under-damped transient response, but proper ceramic chip capacitors placed near loads can be used as decoupling capacitors.

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